Joining method for joining components

Metal fusion bonding – Process – Specific mode of heating or applying pressure

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S246000

Reexamination Certificate

active

07975902

ABSTRACT:
A method is provided for connecting components particularly in the field of aerospace wherein a first component is connected to a second component, comprising the following steps: arranging at least one nano- or microstructured material between the first and the second component, initiating an exothermic reaction of the nano- or microstructured material for connecting both components with each other.

REFERENCES:
patent: 5381944 (1995-01-01), Makowiecki et al.
patent: 5902498 (1999-05-01), Mistry et al.
patent: 6534194 (2003-03-01), Weihs et al.
patent: 6736942 (2004-05-01), Weihs et al.
patent: 6991856 (2006-01-01), Weihs et al.
patent: 7354659 (2008-04-01), Duckham et al.
patent: 7361412 (2008-04-01), Wang et al.
patent: 7635076 (2009-12-01), Duckham et al.
patent: 7644854 (2010-01-01), Holmes et al.
patent: 2002/0069944 (2002-06-01), Weihs et al.
patent: 2004/0041006 (2004-03-01), Masingale
patent: 2004/0149813 (2004-08-01), Weihs et al.
patent: 2005/0051607 (2005-03-01), Wang et al.
patent: 2006/0219759 (2006-10-01), Duckham et al.
patent: 2007/0023489 (2007-02-01), Swiston et al.
patent: 2007/0235500 (2007-10-01), Suh et al.
patent: 2008/0063889 (2008-03-01), Duckham et al.
patent: 2008/0093418 (2008-04-01), Weihs et al.
patent: 2008/0110962 (2008-05-01), Saxena et al.
patent: 2008/0272181 (2008-11-01), Wang et al.
patent: 2008/0299410 (2008-12-01), Duckham et al.
patent: 2008/0314735 (2008-12-01), Weihs et al.
patent: 2009/0065554 (2009-03-01), Heerden et al.
patent: 2009/0173626 (2009-07-01), Duckham et al.
patent: 2009/0186195 (2009-07-01), Spraker et al.
patent: 2009/0242615 (2009-10-01), Saxena et al.
patent: 103 34 391 (2005-03-01), None
German Examination Report, German Application No. 10 2007 020 389.8-24, Jan. 26, 2011, 8 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Joining method for joining components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Joining method for joining components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Joining method for joining components will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2668747

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.