Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1980-12-04
1983-09-06
Hampilos, Gus T.
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
228193, 22826318, 415118, B23K 2800
Patent
active
044024479
ABSTRACT:
Disclosed is a two-step process of joining a lead wire to a 2.times.10.sup.-6 m thick platinum alloy film which rests upon an equally thin alumina insulating layer which is adhered to a metal substrate. Typically the platinum alloy film forms part of a thermocouple for measuring the surface temperature of a gas turbine airfoil. In the first step the lead wire is deformed 30-60% at room temperature while the characteristic 10.sup.6 ohm resistance of the alumina insulating layer is monitored for degradation. In the second step the cold pressed assembly is heated at 865.degree.-1025.degree. C. for 4-75 hr in air. During the heating step any degradation of insulating layer resistance may be reversed, provided the resistance was not decreased below 100 ohm in the cold pressing.
REFERENCES:
patent: 3006067 (1961-10-01), Anderson et al.
patent: 3087239 (1963-04-01), Clagett et al.
patent: 3444006 (1969-05-01), Duncan et al.
patent: 3568301 (1971-03-01), Shibata et al.
patent: 3763545 (1973-10-01), Spanjer
patent: 4104605 (1978-08-01), Boudreaux et al.
Thin Film Technology, by Berry, et al., Van Nostrand Reinhold, New York (1968), title page and overlead, xix-xxi, 559-561, 583-595, 602-612, and 630-632, including major parts of chapter 12 relating to Lead Attachment.
Claing Richard G.
Przybyszewski John S.
Hampilos Gus T.
Jordan M.
Manning John R.
Musial Norman T.
The United States of America as represented by the Administrator
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