Jig for electroplating lead pins of an integrated circuit packag

Details Jig for electroplating lead pins of an integrated circuit packag Jig for electroplating lead pins of an integrated circuit packag

1995-05-24

1996-12-03

Niebling, John

Chemistry: electrical and wave energy

Apparatus

Electrolytic

205122, 205123, C25D 1704

Patent

active

055804322

ABSTRACT:
Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins in corresponding one of openings formed in a plating jig made of an electrically conductive material for thereby bringing a side surface of each of the lead pins in contact with the jig. The portions of the package are electroplated under the condition where each of the lead pins is held in conduction. After the electroplating, each of the lead pins is separated from the jig through movement in the direction differing from an axial direction of each of the lead pins. Various jigs used for carrying out the above method are also disclosed.

REFERENCES:
patent: 4362991 (1982-12-01), Carbine
patent: 5022976 (1991-06-01), Roll et al.
patent: 5087331 (1992-08-01), Roll et al.
patent: 5240588 (1993-08-01), Uchida
patent: 5342992 (1994-08-01), Noto

Affiliated with

Also associated with

Rating

Jig for electroplating lead pins of an integrated circuit packag does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Jig for electroplating lead pins of an integrated circuit packag, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Jig for electroplating lead pins of an integrated circuit packag will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-782321