Jig for a semiconductor substrate

Details Jig for a semiconductor substrate Jig for a semiconductor substrate

2008-07-08

2008-07-08

Sells, James (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S580000

Reexamination Certificate

active

07395847

ABSTRACT:
The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame21, and a rubber film22arranged within the outer frame21and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film22increases, the wafer-fixing jig20deforms the rubber film and allows the tapes2and6arranged between the wafer1and the rubber film22A to be pushed toward the wafer1gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

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