Metal fusion bonding – Including means to apply flux or filler to work or applicator
Patent
1996-09-23
1999-04-20
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
228262, 118300, 2391022, 222592, 222593, B23K 306, B23K 3706
Patent
active
058949801
ABSTRACT:
An apparatus for depositing a selected pattern of solder onto a substrate comprising: a substrate support having structure for bearing a substrate on which one or more electronic components are to be mounted; a solder ejector that defines a cavity for containing molten solder and an orifice for ejecting a stream of molten solder; a heater for heating the solder to a temperature above the melting point of solder; a vibrator coupled to the solder ejector to form droplets in the stream at the desired frequency for deposition onto the substrate; and a cooler, adapted to receive a coolant, disposed between the heater and the vibrator to maintain the temperature of the vibrator below that which would detrimentally affect the performance of the vibrator.
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Muntz Eric Phillip
Orme-Marmarelis Melissa E.
Heinrich Samuel M.
Rapid Analysis Development Comapny
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