Jet singulation

Details Jet singulation Jet singulation

2006-12-26

2006-12-26

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S075000, C451S087000, C438S460000

Reexamination Certificate

active

07153186

ABSTRACT:
Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball grid arrays (BGA), flip chips, lead less packages (QFN) and the like. The techniques are also suitable for singulating photonic devices.

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