Jet singulation

Details Jet singulation Jet singulation

2006-06-13

2006-06-13

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S038000, C451S388000, C125S035000

Reexamination Certificate

active

07059940

ABSTRACT:
Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball grid arrays (BGA), flip chips, lead less packages (QFN) and the like. The techniques are also suitable for singulating photonic devices.

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Letter from Intercon Technology, Inc. regarding Semicon Taiwan 2002, dated Aug. 23, 2002.
Dean et al., “New Fine-Beam, Adrasive Water Jet Technology Enables Photonic and Small Device Singulation” Chip Scale Review, Aug./Sep. 2002.

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