Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-05-20
2008-05-20
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S718000, C165S080400, C165S104330, C165S908000, C257S714000
Reexamination Certificate
active
07375962
ABSTRACT:
A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.
REFERENCES:
patent: 3109485 (1963-11-01), Fortier
patent: 4064300 (1977-12-01), Bhangu
patent: 4108242 (1978-08-01), Searight et al.
patent: 4201195 (1980-05-01), Sakhuja
patent: 4622946 (1986-11-01), Hurley et al.
patent: 4750086 (1988-06-01), Mittal
patent: 5063476 (1991-11-01), Hamadah et al.
patent: 5126919 (1992-06-01), Yamamoto et al.
patent: 5183104 (1993-02-01), Novotny
patent: 5220804 (1993-06-01), Tilton et al.
patent: 5349831 (1994-09-01), Daikoku et al.
patent: 5718117 (1998-02-01), McDunn et al.
patent: 5854092 (1998-12-01), Root et al.
patent: 6000908 (1999-12-01), Bunker
patent: 6366462 (2002-04-01), Chu et al.
patent: 6378605 (2002-04-01), Kutscher et al.
patent: 6431260 (2002-08-01), Agonafer et al.
patent: 6519151 (2003-02-01), Chu et al.
patent: 6571569 (2003-06-01), Rini et al.
patent: 7079393 (2006-07-01), Colgan et al.
patent: 2002/0062945 (2002-05-01), Hocker et al.
patent: 2006/0162365 (2006-07-01), Hoang et al.
“Direct Liquid Jet Impingement Modules dor High Heat Flux Electronics Packages”, Campbell et al., U.S. Appl. No. 11/427,380, filed Jun. 29, 2006.
Campbell Levi A.
Chu Richard C.
Ellsworth, Jr. Michael J.
Iyengar Madhusudan K.
Schmidt Roger R.
Esq. Lily Neff
Gandhi Jayprakash N
Heslin Rothenberg Farley & Mesisti, P.C.
Hoffberg Robert J
International Business Machines - Corporation
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