Jet nozzle structure for soldering apparatus

Details Jet nozzle structure for soldering apparatus Jet nozzle structure for soldering apparatus

2006-04-25

2006-04-25

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

Reexamination Certificate

active

07032803

ABSTRACT:
A jet nozzle structure for a soldering apparatus for soldering a local area of a substrate on which electric components are placed improves the soldering performance. The soldering apparatus includes a tubular body formed on a soldering bath filled with molten solder, an opening rim at a top of the tubular body forming a top opening to expose the molten solder for soldering electronic components placed on a specified local area of the substrate, and one or more flow openings which are established on a side wall of the tubular body at a position lower than the opening rim by a predetermined distance.

REFERENCES:
patent: 3379356 (1968-04-01), Eith
patent: 4254158 (1981-03-01), Fukuzuka et al.
patent: 4610391 (1986-09-01), Nowotarski
patent: 4981249 (1991-01-01), Kawashima et al.
patent: 5042708 (1991-08-01), Ledermann et al.
patent: 5121874 (1992-06-01), Deambrosio et al.
patent: 5152447 (1992-10-01), Wallgren et al.
patent: 5176307 (1993-01-01), Hagerty et al.
patent: 5193734 (1993-03-01), Takayama et al.
patent: 5228614 (1993-07-01), Elliott et al.
patent: 6138890 (2000-10-01), Kanno et al.
patent: 6247630 (2001-06-01), Terry et al.
patent: 6499645 (2002-12-01), Arakane

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