Jet etch apparatus for decapsulation of molded devices

Details Jet etch apparatus for decapsulation of molded devices Jet etch apparatus for decapsulation of molded devices

1980-09-29

1982-08-17

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

134151, 156627, 156640, 156655, 156668, 2041292, 2041296, B44C 122, C03C 1500, C03C 2506, B41C 100

Patent

active

043448097

ABSTRACT:
A jet etch apparatus and method for decapsulation of molded devices having an etching block through which an etchant solution is drawn. The etchant solution which flows through the etching block forms a jet spray that impinges upon a device to be decapsulated. The etchant solution is drawn through the etching block by means of suction created by a jet pump. The decapsulation process is monitored by detecting current flow between an electrode in the etchant solution and the device. The imposed current also serves to limit excessive oxidation of aluminum pads within the device, thereby preventing attack of the aluminum by the etchant.

REFERENCES:
patent: 2532907 (1950-12-01), Hangosky
patent: 2937124 (1960-05-01), Vaughan
patent: 4021279 (1977-05-01), Hirs
patent: 4165252 (1979-08-01), Gibbs

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