Jaw cleaving device

Details Jaw cleaving device Jaw cleaving device

1991-10-30

1992-10-13

Phan, Hien H.

Severing by tearing or breaking

Methods

225 2, 225101, 225 965, 437225, H01L 2180, B26F 300, B28D 500

Patent

active

051543338

ABSTRACT:
An apparatus and method for cleaving GaAs laser bars from a cell utilizes a first jaw applied to one end of a laser bar to propagate a cleavage and a second jaw applied to an opposite end which provides a biasing force that assures separation of the bar from the cell along the same crystallographic plane. The apparatus may be used in an ultra-high vacuum environment and allows handling of the bars without contacting the vital areas of the top surfaces or facet faces. The apparatus precisely locates bars after cleavage so that they may be further processed.

REFERENCES:
patent: 3687345 (1972-08-01), Carlson et al.
"Substrate Snapping Apparatus" J. F. Pollitt, Western Electric Technical Digest No. 60, Oct. 1980, pp. 17-18.

Affiliated with

Also associated with

Rating

Jaw cleaving device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Jaw cleaving device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Jaw cleaving device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1295078