Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-10-19
1994-11-15
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361767, 361785, 174 524, 257787, H05K 702
Patent
active
053654048
ABSTRACT:
A jack-type semiconductor integrated circuit package with a jack-type connector instead of conventional leads. This package comprises a semiconductor chip which is provided with a plurality of bond pads, a jack housing which is adapted to electrically connect the package to a printed circuit board (PCB) and connected to a plurality of connection pins, a resin film which electrically connects the bond pads of the semiconductor chip to the connection pins of the jack housing, bonds the jack housing to the semiconductor chip and contains a plurality of conductive wires and a sealing resin housing which seals both the semiconductor chip and the jack housing and is formed in a predetermined shape by a molding process. The present package makes the operational reliability be improved and is especially suited for providing a high density IC memory chip package.
REFERENCES:
patent: 4331371 (1982-05-01), Ichimura et al.
patent: 4340266 (1982-07-01), Grovender
patent: 4598965 (1986-07-01), Bricaud et al.
patent: 4936783 (1990-06-01), Petersen
patent: 5180976 (1993-01-01), Van Loan et al.
Goldstar Electron Co. Ltd.
Picard Leo P.
Whang Young S.
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