J-lead conditioning method and apparatus

Details J-lead conditioning method and apparatus J-lead conditioning method and apparatus

1997-09-24

1998-10-27

Larson, Lowell A.

Wireworking

Wire straightening

B21F 102

Patent

active

058266305

ABSTRACT:
An electronic device package lead conditioning method and system corrects bowed-in J-leads (36) of an electronic device package (30) by inserting between a bowed-in J-lead (36) and electronic device package (36) a comb-like tooth (42) having a graduating-width edge, the graduating width edge graduating from a minimum width (112) to a maximum width (114). The minimum width permits the graduating width edge (112) to be inserted into a space (110) separating the bowed-in J-lead (36) from electronic device package (30). The maximum width (114) at least equals the width of a desired spacing for the bowed-in J-lead (36) from the electronic device package (30) for correcting for the bowed-in-condition of the bowed-in J-lead (36).

REFERENCES:
patent: 4691747 (1987-09-01), Sokolovsky
patent: 4765376 (1988-08-01), Leiwe
patent: 5219404 (1993-06-01), Moore et al.
patent: 5249239 (1993-09-01), Kida
patent: 5273081 (1993-12-01), Maksim
patent: 5402505 (1995-03-01), Roy et al.
patent: 5406372 (1995-04-01), Vodanovic et al.
patent: 5477894 (1995-12-01), Wakabayashi et al.
patent: 5487416 (1996-01-01), Maksim

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