ITO film-formed substrate, and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material

Reexamination Certificate

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C438S022000, C438S030000, C257S072000

Reexamination Certificate

active

07005673

ABSTRACT:
An ITO film-formed substrate having excellent alkali resistance and adhesion is provided. For the ITO film-formed substrate, a structure is adopted in which a color filter102, an organic protective film103, intermediate layers104aand104b, and an ITO film105having an electrode pattern patterned therein are formed in this order from the bottom upwards on a surface of a glass substrate101. The intermediate layer104ais deposited on a surface of the organic protective film103through a high-frequency sputtering method using Ar as an introduced gas, and is made of a metal oxide that is not prone to dissolving in alkalis; the intermediate layer104bis deposited through a reactive sputtering method or a high-frequency sputtering method, and is made of a metal oxide or metal nitride that is not prone to dissolving in alkalis.

REFERENCES:
patent: 6277507 (2001-08-01), Anzaki et al.
patent: 6-148618 (1994-05-01), None
patent: 2000-180840 (2000-06-01), None

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