iTFC with optimized C(T)

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S306100, C361S306300, C361S301400, C361S311000, C361S313000

Reexamination Certificate

active

07656644

ABSTRACT:
A method including depositing a suspension of a colloid having an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of a substrate; and thermally treating the plurality of nano-particles to form a thin film. A system including a computing device having a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate having at least one capacitor structure formed on a surface, the capacitor structure having a first electrode, a second electrode, and a ceramic material disposed between the first electrode and the second electrode, wherein the ceramic material has columnar grains.

REFERENCES:
patent: 4241378 (1980-12-01), Dorrian
patent: 4458295 (1984-07-01), Durschlag et al.
patent: 4528613 (1985-07-01), Stetson et al.
patent: 4687540 (1987-08-01), Singhdeo et al.
patent: 4702967 (1987-10-01), Black et al.
patent: 5065275 (1991-11-01), Fujisaki et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5160762 (1992-11-01), Brand et al.
patent: 5172304 (1992-12-01), Ozawa et al.
patent: 5177670 (1993-01-01), Shinohara et al.
patent: 5191510 (1993-03-01), Huffman
patent: 5206788 (1993-04-01), Larson et al.
patent: 5504993 (1996-04-01), Szerlip et al.
patent: 5600532 (1997-02-01), Michiya et al.
patent: 5745334 (1998-04-01), Hoffarth et al.
patent: 5795799 (1998-08-01), Hosoya
patent: 5796572 (1998-08-01), Kawai
patent: 5800575 (1998-09-01), Lucas
patent: 5889647 (1999-03-01), Hansen et al.
patent: 5912044 (1999-06-01), Farooq et al.
patent: 5952040 (1999-09-01), Yadav et al.
patent: 5978207 (1999-11-01), Anderson et al.
patent: 5989935 (1999-11-01), Abbott et al.
patent: 6043973 (2000-03-01), Nagashima et al.
patent: 6058004 (2000-05-01), Duva et al.
patent: 6125027 (2000-09-01), Klee et al
patent: 6178082 (2001-01-01), Farooq et al.
patent: 6180252 (2001-01-01), Farrell et al.
patent: 6207522 (2001-03-01), Hunt et al.
patent: 6207552 (2001-03-01), Wang et al.
patent: 6214445 (2001-04-01), Kanbe et al.
patent: 6216324 (2001-04-01), Farooq et al.
patent: 6226172 (2001-05-01), Sato et al.
patent: 6351368 (2002-02-01), Kim
patent: 6366444 (2002-04-01), Yagi
patent: 6372286 (2002-04-01), Azuma et al.
patent: 6407929 (2002-06-01), Hale et al.
patent: 6433993 (2002-08-01), Hunt et al.
patent: 6437970 (2002-08-01), Lee et al.
patent: 6477034 (2002-11-01), Chakravorty et al.
patent: 6524352 (2003-02-01), Adae-Amoakoh et al.
patent: 6541137 (2003-04-01), Kingon et al.
patent: 6577490 (2003-06-01), Ogawa et al.
patent: 6586791 (2003-07-01), Lee et al.
patent: 6597068 (2003-07-01), Petrarca et al.
patent: 6617681 (2003-09-01), Bohr
patent: 6623865 (2003-09-01), Zou et al.
patent: 6631551 (2003-10-01), Bowles et al.
patent: 6638378 (2003-10-01), O'Bryan et al.
patent: 6672912 (2004-01-01), Figueroa
patent: 6678145 (2004-01-01), Naito et al.
patent: 6775150 (2004-08-01), Chakravorty et al.
patent: 6795296 (2004-09-01), Palanduz et al.
patent: 6891258 (2005-05-01), Alexander et al.
patent: 6907658 (2005-06-01), Li
patent: 6909593 (2005-06-01), Kuroda et al.
patent: 6937035 (2005-08-01), Kawaike et al.
patent: 6961230 (2005-11-01), Otsuka et al.
patent: 6980416 (2005-12-01), Sakaguchi et al.
patent: 7002075 (2006-02-01), Kambe et al.
patent: 7038235 (2006-05-01), Seitz
patent: 7072167 (2006-07-01), Borland
patent: 2001/0019144 (2001-09-01), Roy
patent: 2001/0054748 (2001-12-01), Wikborg et al.
patent: 2002/0058163 (2002-05-01), Uzoh
patent: 2002/0080551 (2002-06-01), Kitagawa et al.
patent: 2002/0081838 (2002-06-01), Bohr
patent: 2002/0175402 (2002-11-01), McCormack et al.
patent: 2003/0016026 (2003-01-01), Kawaike et al.
patent: 2003/0039813 (2003-02-01), Kitai et al.
patent: 2003/0136997 (2003-07-01), Shioga et al.
patent: 2003/0170432 (2003-09-01), Kobayashi et al.
patent: 2003/0174994 (2003-09-01), Garito et al.
patent: 2003/0184953 (2003-10-01), Lee et al.
patent: 2003/0207150 (2003-11-01), Maria et al.
patent: 2003/0230768 (2003-12-01), Seitz
patent: 2004/0027813 (2004-02-01), Li
patent: 2004/0065912 (2004-04-01), Liu et al.
patent: 2004/0081760 (2004-04-01), Burns et al.
patent: 2004/0081811 (2004-04-01), Casper et al.
patent: 2004/0089471 (2004-05-01), Andoh et al.
patent: 2004/0126484 (2004-07-01), Croswell et al.
patent: 2004/0175585 (2004-09-01), Zou et al.
patent: 2004/0238957 (2004-12-01), Akram et al.
patent: 2004/0257749 (2004-12-01), Otsuka et al.
patent: 2005/0011857 (2005-01-01), Borland et al.
patent: 2005/0118482 (2005-06-01), Sriramulu et al.
patent: 2005/0151156 (2005-07-01), Wu et al.
patent: 2005/0213020 (2005-09-01), Takeda et al.
patent: 2006/0099803 (2006-05-01), Min
patent: 2006/0143886 (2006-07-01), Srinivasan et al.
patent: 0977218 (2000-02-01), None
patent: 62250626 (1987-10-01), None
patent: 02-005507 (1990-01-01), None
patent: 03-178112 (1991-08-01), None
patent: 03208323 (1991-09-01), None
patent: 050744651 (1993-03-01), None
patent: 07-122456 (1995-05-01), None
patent: 2002/297939 (2001-10-01), None
patent: 2002075782 (2002-03-01), None
patent: 2003163559 (2003-06-01), None
patent: 2003197463 (2003-07-01), None
Office Action for 10/882,745, mailed Mar. 17, 2005 (12 pgs).
Office Action for 10/882,745, mailed Oct. 4, 2005 (10 pgs).
Office Action for 10/882,745, mailed Apr. 3, 2006 (9 pgs).
Office Action for 10/882,745, mailed Aug. 30, 2006 (12 pgs).
Office Action for 10/882,745, mailed Jan. 10, 2007 (13 pgs).
Office Action for 10/882,745, mailed May 1, 2007 (12 pgs).
Office Action for 10/882,745, mailed Sep. 27, 2007 (11 pgs).
Office Action for 10/882,745, mailed Jan. 16, 2008 (9 pgs).
Office Action for 10/971,829, mailed Mar. 8, 2006 (8 pgs).
Office Action for 10/971,829, mailed Aug. 14, 2006 (8 pgs).
Office Action for 10/971,829, mailed Jan. 3, 2007 (8 pgs.).
Office Action for 10/974,139, mailed Mar. 9, 2006 (10 pgs).
Office Action for 10/974,139, mailed Dec. 13, 2006 (11 pgs.).
Office Action for 10/974,139, mailed Apr. 17, 2007 (12 pgs).
Office Action for 10/974,139, mailed Oct. 9, 2007 (10 pgs).
Office Action for 10/976,425, mailed Mar. 26, 2007 (7 pgs).
Office Action for 10/976,425, mailed Sep. 26, 2007 (6 pgs).
Office Action for 11/172,544, mailed Dec. 15, 2006 (12 pgs.).
Office Action for 11/172,544, mailed Apr. 19, 2007 (10 pgs).
Office Action for 11/172,544, mailed Oct. 10, 2007 (10 pgs).
PCT International Search Report dated Nov. 4, 2005, PCT-US2005/022356, filed Jun. 23, 2005.
PCT International Search Report and Written Opinion dated May 8, 2006, PCT-US2005/037626 (9 pages).
Article on the web on Answers.com about different ceramic material from Wikipedia <http:--www.answers.com-topic-ceramics?cat=technology> (7 pages).
Imanaka, Yoshihiko et al., “Decoupling Capacitor with Low Inductance for High-Frequency Digital Applications,” Fujitsu Sci. Tech. J., 38, Jun. 1, 2002, pp. 22-30.
Nagata, Hirotoshi et al., “Improvement of Bonding Strength Between Au-Ti and SiO2 Films by Si Layer Insertion,” J. Vac. Sci. Technol. A 17(3), May-Jun. 1999, pp. 1018-1023.
Ohly, C. et al., “Defects in Alkaline Earth Titanate Thin Films—the Conduction Behavior of Doped BST,” Integrated Ferroelectrics, 2001, 38, pp. 229-237.
Ohly, C. et al., “Electrical Conductivity and Segregation Effects of Doped SrTiO3 Thin Films,” Journal of the European Ceramic Society, 2001, 21(10-11), pp. 1673-1676.
Ohly, C. et al., “High Temperature Conductivity Behaviorof Doped SrTiO3 Thin Films,” Integrated Ferroelectrics, 2001, 33, pp. 362-372.
Voisard, Cyril et al., “Electrical Conductivity of Strontium Bismuth Titanate under Controlled Oxygen Partial Pressure,” Jour of the Euro Ceramic Society, 19, 1999, pp. 1251-1254.
Yoo, Han-III et al., “Defect Structure and Chemical Diffusion in BaTiO3,” Solid State Ionics 135, 2000, pp. 619-623.
Felten, .J., et al.: Embedded Ceramic Resistors and Capacitors in PWB: Process and Performance; http:--edc.ncms.org

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

iTFC with optimized C(T) does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with iTFC with optimized C(T), we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and iTFC with optimized C(T) will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4221679

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.