iTFC with optimized C(T)

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S300000, C257S700000, C257S703000, C257S705000

Reexamination Certificate

active

07375412

ABSTRACT:
A method including depositing a suspension of a colloid comprising an amount of nano-particles of a ceramic material on a substrate; and thermally treating the suspension to form a thin film. A method including depositing a plurality of nano-particles of a ceramic material to pre-determined locations across a surface of a substrate; and thermally treating the plurality of nano-particles to form a thin film. A system including a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate comprising at least one capacitor structure formed on a surface, the capacitor structure comprising a first electrode, a second electrode, and a ceramic material disposed between the first electrode and the second electrode, wherein the ceramic material comprises columnar grains.

REFERENCES:
patent: 4241378 (1980-12-01), Dorrian
patent: 4458295 (1984-07-01), Durschlag et al.
patent: 4528613 (1985-07-01), Stetson et al.
patent: 4687540 (1987-08-01), Singhdeo et al.
patent: 5065275 (1991-11-01), Fujisaki et al.
patent: 5155655 (1992-10-01), Howard et al.
patent: 5160762 (1992-11-01), Brand et al.
patent: 5172304 (1992-12-01), Ozawa et al.
patent: 5177670 (1993-01-01), Shinohara et al.
patent: 5191510 (1993-03-01), Huffman
patent: 5206788 (1993-04-01), Larson et al.
patent: 5745334 (1998-04-01), Hoffarth et al.
patent: 5796572 (1998-08-01), Kawai
patent: 5800575 (1998-09-01), Lucas
patent: 5889647 (1999-03-01), Hansen et al.
patent: 5912044 (1999-06-01), Farooq et al.
patent: 5978207 (1999-11-01), Anderson et al.
patent: 6043973 (2000-03-01), Nagashima et al.
patent: 6058004 (2000-05-01), Duva et al.
patent: 6178082 (2001-01-01), Farooq et al.
patent: 6216324 (2001-04-01), Farooq et al.
patent: 6226172 (2001-05-01), Sato et al.
patent: 6351368 (2002-02-01), Kim
patent: 6372286 (2002-04-01), Azuma et al.
patent: 6433993 (2002-08-01), Hunt et al.
patent: 6437970 (2002-08-01), Lee et al.
patent: 6477034 (2002-11-01), Chakravorty et al.
patent: 6524352 (2003-02-01), Adae-Amoakoh et al.
patent: 6541137 (2003-04-01), Kingon et al.
patent: 6623865 (2003-09-01), Zou et al.
patent: 6631551 (2003-10-01), Bowles et al.
patent: 6638378 (2003-10-01), O'Bryan et al.
patent: 6672912 (2004-01-01), Figueroa
patent: 6775150 (2004-08-01), Chakravorty et al.
patent: 6795296 (2004-09-01), Palanduz et al.
patent: 6980416 (2005-12-01), Sakaguchi et al.
patent: 7072167 (2006-07-01), Borland
patent: 2001/0019144 (2001-09-01), Roy
patent: 2001/0054748 (2001-12-01), Wikborg et al.
patent: 2002/0080551 (2002-06-01), Kitagawa et al.
patent: 2003/0016026 (2003-01-01), Kawaike et al.
patent: 2003/0136997 (2003-07-01), Shioga et al.
patent: 2003/0184953 (2003-10-01), Lee et al.
patent: 2003/0207150 (2003-11-01), Maria et al.
patent: 2003/0230768 (2003-12-01), Seitz
patent: 2004/0027813 (2004-02-01), Li
patent: 2004/0065912 (2004-04-01), Liu et al.
patent: 2004/0081811 (2004-04-01), Casper et al.
patent: 2004/0089471 (2004-05-01), Andoh et al.
patent: 2004/0126484 (2004-07-01), Croswell et al.
patent: 2004/0175585 (2004-09-01), Zou et al.
patent: 2004/0257749 (2004-12-01), Otsuka et al.
patent: 2005/0011857 (2005-01-01), Borland et al.
patent: 2005/0118482 (2005-06-01), Sriramulu et al.
patent: 2005/0151156 (2005-07-01), Wu et al.
patent: 2006/0099803 (2006-05-01), Min
patent: 2006/0143886 (2006-07-01), Srinivasan et al.
patent: 0977218 (2000-02-01), None
patent: 02-005507 (1990-01-01), None
patent: 03-178112 (1991-08-01), None
patent: 07-122456 (1995-05-01), None
patent: 2002-297939 (2001-10-01), None
patent: 2002-305125 (2002-10-01), None
PCT Search Report and Written Opinion for PCT Appln. No. PCT/US2005/037626, mailed May 8, 2006 (9 pages).
Felten, J, et al.: Embedded Ceramic Resistors and Capacitors in PWB: Process and Performance; http://edc.ncms.org/ (2004) 7 pages.
Offerman, SE, et al.: Grain Nucleation and Growth During Phase Transformations; Science (2002) 298-1003-1005.
Office Action for U.S. Appl. No. 11/172,544, mailed Dec. 15, 2006 (12 pages).
Office Action for U.S. Appl. No. 10/974,139, mailed Dec. 13, 2006 (11 pages).
Office Action for U.S. Appl. No. 10/971,829, mailed Jan. 3, 2007 (8 pages).
Office Action for U.S. Appl. No. 10/882,745, mailed Mar. 17, 2005 (12 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Oct. 4, 2005 (10 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Apr. 3, 2006 (9 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Aug. 30, 2006 (12 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed Jan. 10, 2007 (13 pgs).
Office Action for U.S. Appl. No. 10/882,745, mailed May 1, 2007 (12 pgs).
Office Action for U.S. Appl. No. 10/971,829, mailed Mar. 8, 2006 (8 pgs).
Office Action for U.S. Appl. No. 10/971,829, mailed Aug. 14, 2006 (8 pgs).
Office Action for U.S. Appl. No. 10/974,139, mailed Mar. 9, 2006 (10 pgs).
Office Action for U.S. Appl. No. 10/974,139, mailed Apr. 17, 2007 (12 pgs).
Office Action for U.S. Appl. No. 10/976,425, mailed Mar. 26, 2007 (7 pgs).
Office Action for U.S. Appl. No. 11/172,544, mailed Apr. 19, 2007 (10 pgs).
PCT International Search Report dated Nov. 4, 2005, PCT/US2005/022356, filed Jun. 23, 2005.
Article on the web on Answers.com about different ceramic material from Wikipedia <http://www.answers.com/topic/ceramics?cat=technology> (7 pages).
Imanaka, Yoshihiko et al., “Decoupling Capacitor with Low Inductance for High-Frequency Digital Applications,” FUJITSU Sci. Tech. J., 38, 1, Jun. 2002, pp. 22-30.
Nagata, Hirotoshi et al., “Improvement of Bonding Strength Between Au/Ti and SiO2Films by Si Layer Insertion,” J. Vac. Sci. Technol. A 17(3), May/Jun. 1999, pp. 1018-1023.
Ohly, C. et al., “Defects in Alkaline Earth Titanate Thin Films—the Conduction Behavior of Doped BST,” Integrated Ferroelectrics, 2001, 38, pp. 229-237.
Ohly, C. et al., “Electrical Conductivity and Segregation Effects of Doped SrTiO3 Thin Films,” Journal of the European Ceramic Society, 2001, 21(10-11), pp. 1673-1676.
Ohly, C. et al., “High Temperature Conductivity Behavior of Doped SrTiO3Thin Films,” Integrated Ferroelectrics, 2001, 33, pp. 362-372.
Voisard, Cyril et al., “Electrical Conductivity of Strontium Bismuth Titanate under Controlled Oxygen Partial Pressure,” Journal of the European Ceramic Society, 19, 1999, pp. 1251-1254.
Yoo, Han-Ill et al., “Defect Structure and Chemical Diffusion in BaTiO3,” Solid State Ionics 135, 2000, pp. 619-623.
Office Action for 11/096,315, mailed Jan. 25, 2008 (24 pp).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

iTFC with optimized C(T) does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with iTFC with optimized C(T), we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and iTFC with optimized C(T) will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3982037

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.