Isothermal termination block having a multi-layer thermal conduc

Details Isothermal termination block having a multi-layer thermal conduc Isothermal termination block having a multi-layer thermal conduc

1990-05-31

1992-02-25

Abrams, Neil

Electrical connectors

With provision to dissipate, remove, or block the flow of heat

Distinct heat sink

361387, H05K 720

Patent

active

050909185

ABSTRACT:
An isothermal block has a multi-layer thermal conductor interleaves with different layers of a printed circuit board to provide improved thermal coupling of input terminals and a local temperature sensor mounted on the isothermal block. Each of the layers of the thermal conductor is substantially thinner than substrate layers of the printed circuit board. The layers of the thermal conductor are spaced apart from the terminals so as to be electrically isolated from the terminals. Embedded layers of the thermal conductor are spaced closer to the terminals than are external layers of the thermal conductor.

REFERENCES:
patent: 3061760 (1962-10-01), Ezzo
patent: 3165672 (1965-01-01), Gellert
patent: 3531579 (1970-09-01), Katz
patent: 4475145 (1984-10-01), Heil et al.
patent: 4495378 (1985-01-01), Dotzer et al.
patent: 4725920 (1988-02-01), Ijichi et al.
patent: 4946408 (1990-08-01), Garrett et al.
patent: 4963697 (1990-10-01), Peterson et al.

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