Isolation techniques for reducing dark current in CMOS image...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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C257S513000, C257S520000, C257S223000, C257S230000, C257S292000, C257S523000, C257SE27139, C257SE27145

Reexamination Certificate

active

11141387

ABSTRACT:
A structure for isolating areas in a semiconductor device is provided. The structure includes a trench having first and second portions formed in a substrate. The first portion has a first width, and the second portion has a second width and is below the first portion. The first width is greater than the second width. A first insulating liner is formed along at least lateral sidewalls of the first portion. A spacer material is formed along at least lateral sidewalls of the insulating liner and filling the second portion. A filler material is over said spacer material and within the first portion. Methods for forming the structure are also provided.

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