Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate
2011-06-28
2011-06-28
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Grooved and refilled with deposited dielectric material
C438S436000, C438S437000, C438S773000, C257SE21546, C257SE21628
Reexamination Certificate
active
07968425
ABSTRACT:
Methods and apparatus are provided. An isolation region is formed by lining a trench formed in a substrate with a first dielectric layer by forming the first dielectric layer adjoining exposed substrate surfaces within the trench using a high-density plasma process, forming a layer of spin-on dielectric material on the first dielectric layer so as to fill a remaining portion of the trench, and densifying the layer of spin-on dielectric material.
REFERENCES:
patent: 5518950 (1996-05-01), Ibok et al.
patent: 6211040 (2001-04-01), Liu et al.
patent: 6333218 (2001-12-01), Ngo et al.
patent: 6399461 (2002-06-01), Liu et al.
patent: 6479405 (2002-11-01), Lee et al.
patent: 7118987 (2006-10-01), Fu et al.
patent: 7160787 (2007-01-01), Heo et al.
patent: 7179717 (2007-02-01), Sandhu et al.
patent: 7332409 (2008-02-01), Cha et al.
patent: 7563690 (2009-07-01), Yang
patent: 2005/0186755 (2005-08-01), Smythe, III et al.
patent: 2005/0285179 (2005-12-01), Violette
patent: 2005/0287731 (2005-12-01), Bian et al.
patent: 2006/0094203 (2006-05-01), Choi et al.
Bian Zailong
Fang Xiaolong
Leffert Jay & Polglaze P.A.
Lindsay, Jr. Walter L
Micro)n Technology, Inc.
Pompey Ron
LandOfFree
Isolation regions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Isolation regions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Isolation regions will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2689988