Isolation regions

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S436000, C438S437000, C438S773000, C257SE21546, C257SE21628

Reexamination Certificate

active

07968425

ABSTRACT:
Methods and apparatus are provided. An isolation region is formed by lining a trench formed in a substrate with a first dielectric layer by forming the first dielectric layer adjoining exposed substrate surfaces within the trench using a high-density plasma process, forming a layer of spin-on dielectric material on the first dielectric layer so as to fill a remaining portion of the trench, and densifying the layer of spin-on dielectric material.

REFERENCES:
patent: 5518950 (1996-05-01), Ibok et al.
patent: 6211040 (2001-04-01), Liu et al.
patent: 6333218 (2001-12-01), Ngo et al.
patent: 6399461 (2002-06-01), Liu et al.
patent: 6479405 (2002-11-01), Lee et al.
patent: 7118987 (2006-10-01), Fu et al.
patent: 7160787 (2007-01-01), Heo et al.
patent: 7179717 (2007-02-01), Sandhu et al.
patent: 7332409 (2008-02-01), Cha et al.
patent: 7563690 (2009-07-01), Yang
patent: 2005/0186755 (2005-08-01), Smythe, III et al.
patent: 2005/0285179 (2005-12-01), Violette
patent: 2005/0287731 (2005-12-01), Bian et al.
patent: 2006/0094203 (2006-05-01), Choi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Isolation regions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Isolation regions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Isolation regions will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2689988

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.