Isolation region structure of semiconductor device and method fo

Fishing – trapping – and vermin destroying

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437 69, 437 72, 148DIG50, H01L 2176

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054985668

ABSTRACT:
An isolation region structure of a semiconductor device and a method for fabricating the same using both a buried oxide isolation technique and a local oxidation of silicon technique, thereby capable of having an advantage of high integrity. In the isolation region structure, narrow trenches are filled only with a polysilicon film whereas wide trenches are filled with a field oxide film and a polysilicon film so as to isolate adjacent active regions from each other. The isolation region structure includes a plurality of trenches including narrow ones and wide ones formed in the silicon substrate, a thin oxide film formed on a bottom surface and opposite side surfaces of each of the narrow trenches and opposite side surfaces of each of the wide trenches, a thick field oxide film formed on a bottom surface of each of the wide trenches, a thin nitride film formed to cover the entire surface of a portion of the thin oxide film disposed in each of the narrow trenches, opposite side surfaces of a portion of the thin oxide film disposed in each of the wide trenches and opposite edges of a portion of the thick field oxide film disposed in each of the wide trenches, a polysilicon film filling the narrow trenches and the wide trenches, another thick field oxide film formed over the polysilicon film, and a thin pad oxide film formed over the active regions.

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