Isolating multiple device mount with stress relief

Details Isolating multiple device mount with stress relief Isolating multiple device mount with stress relief

1990-02-06

1991-08-27

Laroche, Eugene R.

357 71, 357 75, 357 58, H01L 2348

Patent

active

050437968

ABSTRACT:
A substrate of copper clad alumina lamina bearing a number of semiconductor dies is adapted to be soldered to a heatsink to provide electrically isolated thermal relief for the dies. Channels of reduced lamina depth are provided between the dies in regions of no cladding to provide a stress relief fracture path. Stresses caused by the mismatch between the thermal coefficient of expansion of the lamina and is heatsink as the substrate is temperature cycled are fracture relieved without risk of die damage or die or substrate detachment.

REFERENCES:
patent: 3829598 (1974-08-01), Darnell
patent: 4236296 (1980-12-01), Woolhouse
Ng et al., Packaging Micro Miniature Devices, 2/3/87 (U.S. Statutory Invention Registration).

Affiliated with

Also associated with

Rating

Isolating multiple device mount with stress relief does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Isolating multiple device mount with stress relief, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Isolating multiple device mount with stress relief will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1418214