Isolated package for multiple semiconductor power components

Details Isolated package for multiple semiconductor power components Isolated package for multiple semiconductor power components

1983-10-31

1989-04-04

Davie, James W.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

361386, 357 75, H01L 2712

Patent

active

048190420

ABSTRACT:
Packaging structure is disclosed for three electrically isolated triacs (4,6,8) all within the same compact package (2). Plural sets of terminals are provided, each set having a pair of main terminals (15-16, 17-18, 19-20) and a gate terminal (39, 40, 41). One of the main terminals has a first substrate section (30, 31, 32) at a peripheral substrate edge (62) and a second substrate section (33, 34, 35) extending normally therefrom to an end portion (48, 49 50) disposed between substrate portions (42 and 24, 43 and 25, 44 and 26) of the gate terminal and the other main terminal, respectively. A power switching semiconductor component (4, 6, 8) is bonded to the end (48, 49, 50) of the extended substrate portion (33, 34, 35) of the one main terminial, which extended section has an open central section in which the gate terminal (39, 40, 41) is bonded to the substrate and isolated from the main terminals (15-16, 17-18, 19-20).

REFERENCES:
patent: 3697814 (1972-10-01), Christman et al.
patent: 3825767 (1974-07-01), Shields
patent: 3958075 (1976-05-01), Kaufman
patent: 4038678 (1977-10-01), Gottbreht et al.
patent: 4079410 (1978-03-01), Schierz
patent: 4156148 (1979-05-01), Kaufman
patent: 4196411 (1980-04-01), Kaufman
patent: 4215235 (1980-07-01), Kaufman
patent: 4218724 (1980-08-01), Kaufman
patent: 4250481 (1981-02-01), Kaufman
patent: 4257091 (1981-03-01), Kaufman
patent: 4266140 (1981-05-01), Kaufman
patent: 4367523 (1983-01-01), Urba

Affiliated with

Also associated with

Rating

Isolated package for multiple semiconductor power components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Isolated package for multiple semiconductor power components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Isolated package for multiple semiconductor power components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-183165