Compositions – Electrically conductive or emissive compositions – Free metal containing
Reexamination Certificate
2005-01-04
2005-01-04
Kopec, Mark (Department: 1751)
Compositions
Electrically conductive or emissive compositions
Free metal containing
C419S023000, C075S255000, C075S331000, C075S229000, C075S337000
Reexamination Certificate
active
06838021
ABSTRACT:
The present invention provides water atomized copper powder comprising substantially irregular shaped copper particles having at least a median D50particle size of from about 10 μm to about 50 μm. The powders of the present invention are suitable for use in electrically conductive compositions, such as copper-based adhesives. The present invention also provides methods of making these copper powders.
REFERENCES:
patent: 3202488 (1965-08-01), Erhreich et al.
patent: 4353816 (1982-10-01), Iwasa
patent: 4960459 (1990-10-01), Poole et al.
patent: 5534045 (1996-07-01), Ogura et al.
patent: 5683627 (1997-11-01), Katayama et al.
patent: WO 8402864 (1984-08-01), None
Klar et al “Copper P/M Products”, Metals Handbook, 10thEd. vol. 2, 1990 pp 392-402.
Cheng Hsiao L.
Khatter Rajesh
Nadkarni Anil V.
Kalow David A.
Kalow & Springut LLP
Kopec Mark
Schmidt William D.
SCM Metal Products Inc.
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