Ionized metal cluster beam systems and methods

Details Ionized metal cluster beam systems and methods Ionized metal cluster beam systems and methods

1993-09-29

1994-07-19

Berman, Jack I.

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

2504923, 250398, H01J 3730

Patent

active

053311728

ABSTRACT:
Ionized metal cluster beam deposition of metal bumps on substrates such as multi-chip modules and integrated circuit chips is enhanced. The present invention discloses wet etching techniques for removing unwanted metal deposited on the substrate around bumps, multiple sources for depositing alloyed (tin-lead) bumps with constant composition, and single or multiple sources for directing a cluster beam through an aperture to deposit metal on a substrate and directing an ion beam at the aperture to remove metal deposited therein.

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