Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating
Patent
1990-08-29
1992-01-07
Weisstuch, Aaron
Chemistry: electrical and wave energy
Processes and products
Vacuum arc discharge coating
20429805, C23C 1432
Patent
active
050788477
ABSTRACT:
An ion plating process wherein a substrate to be plated is suspended in a vacuum chamber filled with an inert gas and radio frequency is supplied to the substrate to be plated to create a plasma which is maintained by the inert gas. Positive DC voltage is then applied to the substrate and negative DC voltage to the filament. Power is then applied to the filament, and upon vaporization of the ion source a plasma of evaporated and ionized deposition material is created between the ion source and the substrate to optimize the deposition of metal plating materials and dielectric materials. The ion source, or vaporizing material is wrapped around a filament which is enclosed within the vacuum chamber. One side of the filament is connected to ground and the vaccum chamber is also ground. The RF power supply feeding power to the substrate is connected to ground and to one side of the wrapped filament and ion source. The DC voltage supply has its positive terminal connected to the RF power line feeding the substrate and its negative terminal joined to the RF power line which is connected to one side of the filament and grounded. Wire mesh grids may be placed between the high temperature ion source and the substrate for more complete control of the plasma, and to direct the plasma flow to certain locations on or around the substrate to be plated. A voltage source may be connected to the grid to control plating on certain parts of the substrate.
REFERENCES:
patent: 3329601 (1967-07-01), Mattox
patent: 4170662 (1979-10-01), Weiss et al.
patent: 4250009 (1981-02-01), Cuomo et al.
patent: 4342631 (1982-08-01), White et al.
Grosman Jerry
Haden, Jr. Wm. H.
Roddy Kenneth A.
Weisstuch Aaron
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