Ion plating apparatus

Details Ion plating apparatus Ion plating apparatus

1978-12-12

1980-07-22

Mack, John H.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204192N, C23C 1500

Patent

active

042138442

ABSTRACT:
An ion plating apparatus having a plurality of vapor sources for supplying the vapors of evaporating materials, the particles of the vapors being ionized and accelerated by an electric field to impinge on the surface of a substrate so as to form a film of the evaporating materials thereon is disclosed. An ionization chamber common to a plurality of the vapor sources, the ionization chamber being composed of parallel filaments for emitting electrons is also disclosed. Grid-shaped electron-accelerating electrodes are provided between the filaments so that the vapors of the evaporating materials pass between them, and the electron-accelerating electrodes kept at a positive potential with respect to the filaments thereby to ionize the vapors of the evaporating materials.

REFERENCES:
patent: 3974059 (1976-08-01), Murayama
patent: 4107350 (1978-08-01), Berg et al.
patent: 4112137 (1978-09-01), Zega

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