Ion implanted gallium arsenide semiconductor devices fabricated

Metal treatment – Compositions – Heat treating

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148187, H01L 2126

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040337880

ABSTRACT:
Electrically isolated active device regions are fabricated in GaAs semi-insulating wafers by the implantation therein of sulphur ions. The implanted wafers are then coated with a passivating oxide and annealed at an elevated temperature of 800.degree. C or greater in order to achieve carrier mobilities in excess of 3000 cm.sup.2 /volt second.

REFERENCES:
patent: 3558366 (1971-01-01), Lepselter
patent: 3649369 (1972-03-01), Hunsperger et al.
patent: 3756861 (1973-09-01), Payne et al.
patent: 3804681 (1974-04-01), Drangeid et al.
patent: 3820235 (1974-06-01), Goldman
patent: 3880676 (1975-04-01), Douglas et al.
Sansbury et al., Radiation Effects, vol. 6, 1970, pp. 269-276, Science Publishers Ltd., Glasgow, Scotland.
Sansbury et al., Applied Physics Letters, vol. 14, No. 10, 1969.
Zelevinskaya et al., Soviet Physics--Semiconductors, vol. 4, No. 2, 1970.
Itoh et al. "As and Cd Implantations into N-type GaAs," J. Appl. Phys., vol. 42, No. 12, Nov. 1971, pp. 5120-5124.

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