Ion-implanted evaporated germanium layers as n.sup.+ contacts t

Metal treatment – Compositions – Heat treating

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148171, 148177, 357 65, H01L 29161, H01L 2348, H01L 738, H01L 21265

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active

042984033

ABSTRACT:
A method of forming a single, reliable n.sup.+ contact for discrete GaAs devices. A film of p-type Ge is deposited uniformly over the surface of a n-type GaAs substrate. Ions of phosphorous or arsenic are implanted to 5.times.10.sup.18 ions/cc at a depth of 1500 A. The ends and the sides of the substrate and Ge layer are capped by a CVD oxide and annealed at 450.degree.-500.degree. C. for about one hour. This process over-compensates the initial p-type layers which results in the Ge layer becoming n.sup.+. The oxide is removed by an etch process and the n.sup.+ Ge is etched to form two separate contact sections of n.sup.+ Ge. The n.sup.+ Ge is then metalized to form ohmic contacts by use of NiAu. A CVD oxide overcoat may again be applied and annealed at about 500.degree. C. to drive a shallow 200-500 A, n.sup.+ germanium diffusion into the substrate.

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