Ion implantation apparatus and ion implanting method

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

Reexamination Certificate

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C250S397000

Reexamination Certificate

active

10950633

ABSTRACT:
An ion implantation apparatus includes an ion irradiation unit. The ion irradiation unit irradiates a plurality of areas of a target substrate with ion beams each of which reaches the substrate at corresponding one incident angle. An incident angle measuring instrument measures the incident angle of each of the ion beams. A controller is provided with information from the incident angle measuring instrument and controls the ion irradiation unit in accordance with the information so that a difference among incident angles is set to within ±0.1°.

REFERENCES:
patent: 5350926 (1994-09-01), White et al.
patent: 6255662 (2001-07-01), Rubin et al.
patent: 6881967 (2005-04-01), Ray
patent: 7105839 (2006-09-01), White
patent: 02-005346 (1990-01-01), None
patent: 6-325723 (1994-11-01), None
patent: 07-172990 (1995-07-01), None
patent: 08-055815 (1996-02-01), None
patent: 09-245722 (1997-09-01), None
patent: 10-040855 (1998-02-01), None
patent: 10-064470 (1998-03-01), None
patent: 11-507762 (1999-07-01), None
patent: 2000-150407 (2000-05-01), None
Copy of Notification of Reasons for Rejection from Japanese Patent Office mailed Feb. 6, 2007, in Japanese Application No. 2004-097065.

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