Ion implantation apparatus and fabrication method for semiconduc

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

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25044211, 250251, H01J 3700

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06037599&

ABSTRACT:
An ion implantation apparatus has a wafer processing chamber which executes ion implantation on plural product wafers 2 while integrally revolving the product wafers 2 at a high speed in a locus passing through an irradiation range of ion beams 1. A wafer wheel 5 having plural wafer holders 4 which radially elongate from a rotating shaft 3 and which respectively hold the product wafers 2 is provided with an electrically conductive body 6 (7, 8) which is grounded and which passes through the irradiation range of the ion beams 1. Further, a method is provided in which ion implantation can be conduced without causing a charge-up, in a production step of a MOS semiconductor device of the extension structure. The source and drain regions of a MOS semiconductor of the extension structure are formed by using the ion implantation apparatus.

REFERENCES:
patent: 5378899 (1995-01-01), Kimber
patent: 5525807 (1996-06-01), Hirokawa et al.
patent: 5696382 (1997-12-01), Kwon
patent: 5731593 (1998-03-01), Kodama

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