Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices
Reexamination Certificate
2006-07-18
2006-07-18
Nguyen, Kiet T. (Department: 2881)
Radiant energy
Irradiation of objects or material
Irradiation of semiconductor devices
C250S492200
Reexamination Certificate
active
07078710
ABSTRACT:
A method of reducing foreign material contamination of a substrate in an ion beam system and an ion beam system. The system, including: a vacuum chamber having an ion beam axis; a substrate chamber free to tilt about a tilt axis, the tilt axis orthogonal to and intersecting the ion beam axis; a flexible bellows connecting an opening in the substrate chamber and an opening in the vacuum chamber, both openings co-axially aligned with the ion beam axis, the bellows providing a vacuum seal between the substrate chamber and the vacuum chamber; and a hollow foreign material shield open at a top proximate to the vacuum chamber and a bottom proximate to the substrate chamber, the foreign material shield located between the ion beam axis and the flexible bellows, the top and bottom of the foreign material shield co-axially aligned with the ion beam axis.
REFERENCES:
patent: 5633506 (1997-05-01), Blake
patent: 5670217 (1997-09-01), Blake et al.
Desai Tushar
Hayford Ellis C.
Mone, Jr. Nicholas
Nguyen Kiet T.
Sabo William D.
Schmeiser Olsen & Watts
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