Ion barrier layer on metals and nonmetals

Chemistry: electrical and wave energy – Processes and products

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C25D 344

Patent

active

049484753

ABSTRACT:
The invention provides an ion barrier formed of a high-purity electroplated aluminum layer (purity >99.99%) which preferably has a thickness of 10 to 20 .mu.m for use on structural parts and shapes of metals and nonmetals, in particular on polyolefins. If desired, the electroplated aluminum layer can be compacted and/or anodically oxidized by post-treatment. The electroplated aluminum layer prevents the intrusion of metal and nonmetal ions into nonmetals, particularly plastic (for example polyolefins), and their penetration to metal surfaces. The deposition of the electroplated aluminum layer occurs from aprotic, oxygen-free and anhydrous electrolyte media of the general formula M.sup.I X.2AlR.sub.3.nLsm, wherein M.sup.I is an alkali metal ion or a quaternary onium ion, X is a halogen ion, preferably F.sup.- or Cl.sup.-, R is an alkyl radical, preferably CH.sub.3, C.sub.2 H.sub.5, C.sub.3 H.sub.7 or C.sub.4 H.sub.9, Lsm is an aromatic solvent molecule, preferably toluene, ethyl benzene, xylene or a mixture thereof, and n=0 to 12, at a bath temperature of 50.degree. to 110.degree. C. and a current density of 0.5 to 10 A/dm.sup. 2 under intensive bath movement. The media may possibly be in the presence of an aromatic solvent.

REFERENCES:
patent: 4101386 (1978-07-01), Dotzer

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