Iodine-containing hot melt pressure sensitive adhesive...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C428S3550EN, C428S3550BL, C523S122000

Reexamination Certificate

active

07871699

ABSTRACT:
An object of the invention is to provide an iodine-containing hot melt pressure sensitive adhesive that can be melted and coated at a temperature not higher than 100° C., and that can retain stability of the iodine in the adhesive through all stages of making, storage and use thereof, without utilizing any harmful organic solvent, while utilizing the antimicrobial efficacy of iodine.

REFERENCES:
patent: 2550622 (1951-04-01), Taub
patent: 4310509 (1982-01-01), Berglund et al.
patent: 4638797 (1987-01-01), Merrill et al.
patent: 4814168 (1989-03-01), Sablotsky et al.
patent: 4990144 (1991-02-01), Blott
patent: 5012801 (1991-05-01), Feret
patent: 5013785 (1991-05-01), Mizui
patent: 5069907 (1991-12-01), Mixon et al.
patent: 5270358 (1993-12-01), Asmus
patent: 5322695 (1994-06-01), Shah et al.
patent: 5369155 (1994-11-01), Asmus
patent: 5607699 (1997-03-01), Hoang et al.
patent: 5635203 (1997-06-01), Gale et al.
patent: 5650215 (1997-07-01), Mazurek et al.
patent: 5670557 (1997-09-01), Dietz et al.
patent: 5674561 (1997-10-01), Dietz et al.
patent: 5779632 (1998-07-01), Dietz et al.
patent: 5803086 (1998-09-01), Scholz et al.
patent: 5829442 (1998-11-01), Cox et al.
patent: 5853750 (1998-12-01), Dietz et al.
patent: 5952398 (1999-09-01), Dietz et al.
patent: 5979450 (1999-11-01), Baker et al.
patent: 6143317 (2000-11-01), Himmelsbach et al.
patent: 6216699 (2001-04-01), Cox et al.
patent: 6566575 (2003-05-01), Stickels et al.
patent: 6723337 (2004-04-01), Song et al.
patent: 6939936 (2005-09-01), Wang et al.
patent: 7189793 (2007-03-01), Wang et al.
patent: 2002/0098349 (2002-07-01), Watanabe et al.
patent: 2003/0165560 (2003-09-01), Otsuka et al.
patent: 2003/0212176 (2003-11-01), Wang et al.
patent: 2007/0142494 (2007-06-01), Kalgutkar et al.
patent: 0272149 (1988-06-01), None
patent: 0528191 (1993-02-01), None
patent: 08-056982 (1996-05-01), None
patent: 09-176021 (1997-08-01), None
patent: WO 95/20634 (1995-08-01), None
patent: WO 97/05171 (1997-02-01), None
patent: WO 00/56828 (2000-09-01), None
patent: WO 00/78885 (2000-12-01), None
patent: WO 02/072162 (2002-09-01), None
patent: WO 03/091354 (2003-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Iodine-containing hot melt pressure sensitive adhesive... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Iodine-containing hot melt pressure sensitive adhesive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Iodine-containing hot melt pressure sensitive adhesive... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2727058

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.