Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-08-02
2005-08-02
Vigushin, John B. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S788000, C439S065000, C439S218000
Reexamination Certificate
active
06924986
ABSTRACT:
Disclosed is a system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circuit board via a first connector, while a second pluggable module is coupled to the circuit board via a second connector such that the second pluggable module is laterally offset from the first pluggable module. The first and second connectors are right angle connectors, and the second right angle connector is inverted relative to the first right angle connector. The first and second pluggable modules are I/O modules for transporting high speed differential signals, and wherein the first pluggable module includes several XFP connectors, and wherein the second pluggable module includes several SFP connectors. The second pluggable module includes several SFP connectors arranged on both sides of the pluggable module.
REFERENCES:
patent: 5017146 (1991-05-01), Uehara et al.
patent: 5181679 (1993-01-01), Frielinghaus et al.
patent: 5233502 (1993-08-01), Beatty et al.
patent: 5305182 (1994-04-01), Chen
patent: 5488541 (1996-01-01), Mistry et al.
patent: 6241530 (2001-06-01), Eddy et al.
patent: 6454585 (2002-09-01), Homer et al.
patent: 6457978 (2002-10-01), Cloonan et al.
patent: 6644979 (2003-11-01), Huang
Bishay Bassem N.
Connor, Jr. Thomas J.
Sardella Steven D.
Strickland Stephen E.
EMC Corporation
Steubing McGuinness & Manaras LLP
Vigushin John B.
LandOfFree
Invertible, pluggable module for variable I/O densities does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Invertible, pluggable module for variable I/O densities, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Invertible, pluggable module for variable I/O densities will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3518782