Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-04-17
2007-04-17
Chérvinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C363S141000, C363S144000
Reexamination Certificate
active
10813444
ABSTRACT:
By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
REFERENCES:
patent: 4458305 (1984-07-01), Buckle et al.
patent: 5956231 (1999-09-01), Yamada et al.
patent: 6414867 (2002-07-01), Suzuki et al.
patent: 6661659 (2003-12-01), Tamba et al.
patent: 6690087 (2004-02-01), Kobayashi et al.
patent: 6768193 (2004-07-01), Nakamura et al.
patent: 2003-153554 (2003-05-01), None
Hagiwara Keizo
Obu Toshiharu
Sekiya Hiroki
Tada Nobumitsu
Yoshioka Shimpei
Chervinsky Boris
Kabushiki Kaisha Toshiba
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