Inverter device and method of manufacturing the device...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S707000, C363S141000, C363S144000

Reexamination Certificate

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10813444

ABSTRACT:
By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

REFERENCES:
patent: 4458305 (1984-07-01), Buckle et al.
patent: 5956231 (1999-09-01), Yamada et al.
patent: 6414867 (2002-07-01), Suzuki et al.
patent: 6661659 (2003-12-01), Tamba et al.
patent: 6690087 (2004-02-01), Kobayashi et al.
patent: 6768193 (2004-07-01), Nakamura et al.
patent: 2003-153554 (2003-05-01), None

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