Inverted microvia structure and method of manufacture

Details Inverted microvia structure and method of manufacture Inverted microvia structure and method of manufacture

2005-12-06

2005-12-06

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S266000, C361S794000, C029S830000

Reexamination Certificate

active

06972382

ABSTRACT:
A multilayer circuit board (50) includes a plurality of substrate cores (34and44), an adhesive/bonding layer (55) between at least two among the plurality of substrate cores, and a microvia (35and45) in each of at least two of the plurality of substrate cores. The microvia includes a conductive interconnection (39) between a top conductive surface and a bottom conductive surface of each of the plurality of substrate cores and the microvia in a first substrate core is arranged to be inverted relative to a microvia in a second substrate core. The multilayer circuit board can further include a plated through-hole (54) through the plurality of substrate cores and the adhesive/bonding layer such that at least two among the top conductive surfaces (32or46) and the bottom conductive surfaces (36or42) of the plurality of substrate cores are connected.

REFERENCES:
patent: 5315072 (1994-05-01), Arai et al.
patent: 5495665 (1996-03-01), Carpenter et al.
patent: 5509200 (1996-04-01), Frankeny et al.
patent: 5758413 (1998-06-01), Chong et al.
patent: 6580036 (2003-06-01), Kim et al.
“HDI's Beneficial Influence on High-Frequency Signal Integrity,” Happy Holden, Westwood Associates, West Haven, CT.

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