Introducing material into a printhead enclosure

Details Introducing material into a printhead enclosure Introducing material into a printhead enclosure

2005-12-02

2008-12-30

Shah, Manish S (Department: 2853)

Incremental printing of symbolic information

Ink jet

Fluid or fluid source handling means

C347S021000, C347S022000, C347S028000

Reexamination Certificate

active

07470016

ABSTRACT:
A printing apparatus includes a jetting assembly including a plurality of nozzles for ejecting droplets on a substrate; an enclosure defining a print zone within which the jetting assembly prints on the substrate, the enclosure including an inlet for introducing a material associated with controlling an environment of the enclosure.

REFERENCES:
patent: 5265315 (1993-11-01), Hoisington et al.
patent: 5371531 (1994-12-01), Rezanka et al.
patent: 6578945 (2003-06-01), Hashi et al.
patent: 6695429 (2004-02-01), Barinaga
patent: 6962411 (2005-11-01), West et al.
patent: 2002/0044185 (2002-04-01), Koitabashi et al.
patent: 2002/0080216 (2002-06-01), Dowell et al.
patent: 2002/0126174 (2002-09-01), Sharma et al.
patent: 2002/0140761 (2002-10-01), Tsurui
patent: 2002/0180854 (2002-12-01), Sato et al.
patent: 2003/0084816 (2003-05-01), Leu et al.
patent: 2003/0160846 (2003-08-01), Yoshida et al.
patent: 2003/0196571 (2003-10-01), Hakiri et al.
patent: 2004/0189744 (2004-09-01), Myhill et al.
patent: 2005/0237370 (2005-10-01), Elgee et al.
patent: 2006/0274116 (2006-12-01), Wu
patent: 2005178251 (2005-07-01), None
U.S. Appl. No. 10/189,947, filed Jul. 3, 2002 Bibl et al.
International Search Report, Patent Cooperation Treaty, May 3, 2007.
U.S. Appl. No. 11/043,841, Moynihan, Filed Jan. 25, 2005; Copies of Application, Pending Claims, and PAIR Transaction History.
U.S. Appl. No. 60/633,240, Baker et al., Filed Dec. 3, 2004; Copies of Appl. Claims, and PAIR Transaction History.

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