Intrinsically conductive moulding compound

Details Intrinsically conductive moulding compound Intrinsically conductive moulding compound

1991-01-22

1993-02-16

Group, Karl

Compositions

Electrically conductive or emissive compositions

252518, 528422, H01B 100

Patent

active

051868610

ABSTRACT:
The invention relates to a process for the preparation of an intrinsically conductive moulding compound obtained by in situ polymerization of monomers which form an intrinsically conductive polymer after polymerization, in the presence of a matrix polymer and a catalyst, the matrix polymer being dissolved in an essentially solvent free monomer, after which the solution obtained is brought into the desired form and the monomers are polymerized in situ in the presence of a catalyst.
Moulding compounds obtained with the process accordingly to the invention can be used in batteries electronic components (diodes, transistors), electrical wiring, coatings and in EMI-shielding attributes.

REFERENCES:
patent: 4604427 (1986-08-01), Roberts et al.
patent: 4705645 (1987-11-01), Lee et al.
patent: 4769115 (1988-09-01), Satoh et al.
patent: 4828756 (1989-05-01), Benton et al.
Tammann, et al., Z. Anorg. U. Allg. Chem., Bd 162, pp. 1-16 (1927).

Affiliated with

Also associated with

Rating

Intrinsically conductive moulding compound does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Intrinsically conductive moulding compound, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Intrinsically conductive moulding compound will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2146538