Intra-module spare routing for high density electronic packages

Details Intra-module spare routing for high density electronic packages Intra-module spare routing for high density electronic packages

1992-06-24

1995-05-09

Teska, Kevin J.

Boots, shoes, and leggings

364490, 364491, 437 7, H05K 700

Patent

active

054146372

ABSTRACT:
A method of fabricating a high density electronic package is disclosed. The package includes a module of laminated semiconductor chips, including spare chip(s) and a supporting substrate with a fixed interconnect pattern. Chip connection pads are provided at a first pad level of the module; one or more pads corresponding to each chip in the module. The module is tested at the first pad level to identify defective chip(s). A spare routing pattern is applied to the module for electrically isolating defective chip(s) and effectively substituting spare chip(s) therefor such that a predetermined pattern of metal interconnect landings on an access surface of the module remains unchanged, as does the supporting substrate.

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Y. C. Lee "Design of HWSI Multichip Modules for Quick Prototyping and Manufacturing", May 20-23, 1990, pp. 586-591, 40th ECTC/IEEE, Las Vegas, Nev.

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