Intra-connection layout of array

Details Intra-connection layout of array Intra-connection layout of array

2011-03-08

2011-03-08

Semenenko, Yuriy (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S260000

Reexamination Certificate

active

07903428

ABSTRACT:
An intra-connection layout of array is disclosed. An alterable area is disposed between the devices of a device array. The alterable area includes an insulation layer, a plurality of first conductive wires and a plurality of second conductive wires. The first conductive wires are disposed within the alterable area along a first direction for selectively connecting electrical paths in the first direction between different devices. The second conductive wires are disposed within the alterable area along a second direction for selectively connecting electrical paths in the second direction between different devices. The insulation layer is disposed within the alterable area and between the above-mentioned first conductive wires and second conductive wires, wherein the insulation layer has an opening to allow one of the first conductive wires and one of the second conductive wires to be contacted with each other.

REFERENCES:
patent: 2004/0251504 (2004-12-01), Noda
patent: 2005/0048695 (2005-03-01), Chia et al.
patent: 2006/0160261 (2006-07-01), Sheats et al.
patent: 2007/0001280 (2007-01-01), Hua
patent: 2009/0191665 (2009-07-01), Nikitin et al.
patent: 2009/0273097 (2009-11-01), Hedler

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