Heat exchange – With retainer for removable article – Electrical component
Patent
1993-04-15
1993-12-14
Rivell, John
Heat exchange
With retainer for removable article
Electrical component
165185, 361699, 257714, F28F 700, H01L 23473
Patent
active
052693724
ABSTRACT:
A cold plate for cooling electronic modules and devices is disclosed which incorporates an intersecting flow network. The flow network is designed and devised such that flow paths are arranged in a rectilinear fashion surrounding blocks of material which act as heat sinks. Supply conduits and return conduits for supplying and returning cooling fluid are disposed orthogonally to the flow directions within the flow paths and such that each supply channel is circumscribed by a plurality of return channels, and each return channel is circumscribed by a plurality of supply channels. The arrangement of the supply and return channels insures the shortest possible flow path for the cooling fluid thereby insuring maximum cooling efficiency and minimizing and localizing the temperature rise in the cooling fluid during passage from the supply conduit to the return conduit. With a minimum temperature rise of the cooling fluid over a short flow path, conduction in the cold plate insures optimum uniformity of cooling to the electronic components. The components of the cold plate either may be assembled and clamped or may be rigidly affixed to one another by means of either soldering or braising to form the structure defining the flow channels, conduits and manifold connections necessary for the consistent and uniform circulation of the cooling fluid.
REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 4034468 (1977-07-01), Koopman
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4748495 (1988-05-01), Kucharek
patent: 4758926 (1988-07-01), Herrell et al.
patent: 4920574 (1990-04-01), Yamamoto et al.
patent: 5088005 (1992-02-01), Ciaccio
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5168348 (1992-12-01), Chu et al.
R. C. Chu et al, "Fluidized Thermal Interface", IBM Tech. Discl. Bulletin, vol. 23, No. 2, Jul. 1980, pp. 700-701.
Chu Richard C.
Ellsworth, Jr. Michael J.
Simons Robert E.
Vader David T.
Cutter Lawrence D.
International Business Machines - Corporation
Leo L. R.
Rivell John
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