Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-07-19
2008-08-26
Arbes, C. J (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S830000, C029S840000, C029S846000
Reexamination Certificate
active
07415762
ABSTRACT:
An interposer to be interposed between a semiconductor chip to be mounted thereon and a packaging board has an interposer portion made of a semiconductor and an interposer portion provided around the foregoing interposer portion integrally therewith. On both surfaces of the interposer portions, wiring patterns are formed via insulating layers. The wiring patterns are electrically connected via through holes formed at required positions in the interposer portions. The outer interposer portion is made of an insulator or a metal body. Further, external connection terminals are bonded to one surface of the interposer.
REFERENCES:
patent: 6265772 (2001-07-01), Yoshida
patent: 6507497 (2003-01-01), Mashino
patent: 6525407 (2003-02-01), Drewery
patent: 2001/0028114 (2001-10-01), Hosomi
patent: 2002/0020898 (2002-02-01), Vu et al.
patent: 2003/0103338 (2003-06-01), Vandentop et al.
patent: 2006/0216861 (2006-09-01), Nakagawa
patent: 2006/0234420 (2006-10-01), Yokozuka et al.
patent: 2001-326305 (2001-11-01), None
patent: WO 2004/047168 (2004-06-01), None
European Search Report dated May 2, 2007.
Fukase Katsuya
Wakabayashi Shinichi
Arbes C. J
Kratz Quintos & Hanson, LLP
Shinko Electric Industries Co. Ltd.
LandOfFree
Interposer, method of fabricating the same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Interposer, method of fabricating the same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interposer, method of fabricating the same, and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4006086