Interposer for decoupling integrated circuits on a circuit...

Details Interposer for decoupling integrated circuits on a circuit... Interposer for decoupling integrated circuits on a circuit...

2011-06-21

2011-06-21

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S768000

Reexamination Certificate

active

07964802

ABSTRACT:
An interposer (20) is used for decoupling a microchip (10) on a circuit board (30). The interposer (20) contains on its upper and lower surfaces structured metal layers (26a-26d) for attachment to the microchip (10) and the circuit board (30), respectively. Inside the interposer, there are two sets of mutually isolated metal structures (21, 22) extending substantially perpendicular to the upper and lower surfaces of said interposer (20). The first set (21) extends closer towards the upper surface than the second set (22), while said second set (22) extends closer towards the lower surface than said first set (21).

REFERENCES:
patent: 6292351 (2001-09-01), Ahiko et al.
patent: 6512182 (2003-01-01), Takeuchi et al.
patent: 6791035 (2004-09-01), Pearson et al.
patent: 7068490 (2006-06-01), Prymak
patent: 7463474 (2008-12-01), Ritter et al.
patent: 7545623 (2009-06-01), Randall et al.
patent: 2004/0108587 (2004-06-01), Chudzik et al.
patent: 2004/0121266 (2004-06-01), Lee et al.
patent: 1 100 096 (2001-05-01), None
patent: 2 622 346 (1989-04-01), None
Joel Peiffer, et al. “Electrical Performance Advantages of Ultra-Thin Dielectric Materials Used for Power-Ground Cores in High Speed, Multilayer Printed Circuit Boards” Manuscript of paper for IPC Expo 2003, Mar. 25-27, 2003, Long Beach, CA, p. 1.
Interconnect Systems Inc., Semiconductor Enhancement Modules, Mar. 2004, pp. 1-8.
Richard Snogren; Emerging Technologies, Embedded Passives: The Next Revolution, Nov. 2002, p. 26-29 and 67.

Affiliated with

Also associated with

Rating

Interposer for decoupling integrated circuits on a circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interposer for decoupling integrated circuits on a circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interposer for decoupling integrated circuits on a circuit... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2677158