Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-08-02
2011-08-02
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S830000, C029S831000, C029S852000
Reexamination Certificate
active
07987588
ABSTRACT:
The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.
REFERENCES:
patent: 6350668 (2002-02-01), Chakravorty
patent: 6570098 (2003-05-01), Shimizu et al.
patent: 6941648 (2005-09-01), Shimizu et al.
patent: 2006/0186524 (2006-08-01), Aiba
Chen Chia-Chun
Huang Kuan-Jui
Huang Shih-Min
Kuo Hui-Chen
Li Hsiu-Ming
Banks Derris H
Chen Yoshimura LLP
Nguyen Tai
Touch Micro-System Technology Inc.
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