Interposer, electrical package, and contact structure and...

Details Interposer, electrical package, and contact structure and... Interposer, electrical package, and contact structure and...

2011-06-28

2011-06-28

Norris, Jeremy C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C029S852000

Reexamination Certificate

active

07968799

ABSTRACT:
A contact structure on a substrate which has at least one contact is provided. The contact structure includes a compliant layer, at least one solder pad, at least one conductive via, and at least one conductive arm. The compliant layer is disposed on the substrate and covers the contact. The solder pad is disposed on the surface of the compliant layer which is at the opposite side of the substrate. The conductive via is disposed in the compliant layer and is connected to the contact. The conductive arm is disposed on the surface of the compliant layer in opposite to the substrate, and two ends of the conductive arm are respectively connected to the conductive via and the solder pad. Furthermore, a method for fabricating the contact structure, an interposer and an electrical package using the contact structure are provided.

REFERENCES:
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 5550325 (1996-08-01), Matsuda
patent: 5576517 (1996-11-01), Wojnarowski et al.
patent: 5763941 (1998-06-01), Fjelstad
patent: 6378758 (2002-04-01), Haba
patent: 6492200 (2002-12-01), Park et al.
patent: 6816385 (2004-11-01), Alcoe
patent: 6836022 (2004-12-01), Boone et al.
“Office Action of Taiwanese counterpart application”, issued on May 27, 2009, p. 1-p. 9.

Affiliated with

Also associated with

Rating

Interposer, electrical package, and contact structure and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interposer, electrical package, and contact structure and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interposer, electrical package, and contact structure and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2660452