Interposer bonding device

Details Interposer bonding device Interposer bonding device

2005-12-03

2009-08-25

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S740000, C029S741000, C029S742000, C029S832000, C228S180210, C156S285000

Reexamination Certificate

active

07578053

ABSTRACT:
An interposer bonding device3is intended for bonding an interposer10having an interposer-side terminal to a base circuit sheet20provided with a base-side terminal. The interposer bonding device3has a press anvil31that holds the base circuit sheet20on which the interposer10is laminated and a bonding head32that moves relatively with respect to the press anvil31. The bonding head32has a pressing surface320that presses the rear surface of the interposer by abutting against this surface. The pressing surface320scans the rear surface of the interposer10by the relative movement of the bonding head32with respect to the press anvil31and presses the whole surface of the interposer-side terminal12toward the base circuit sheet20.

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