Interposer assembly and method

Details Interposer assembly and method Interposer assembly and method

2009-01-16

2010-06-22

Abrams, Neil (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

07740488

ABSTRACT:
An interposer assembly for forming electrical connections between contact pads on opposed substrates includes a top plate, a bottom plate, a lateral shift interface between the plates and a plurality of electrical circuit paths extending between contact surfaces at the top of the top plate and at the bottom of the bottom plate. The circuit paths maintain electrical connections between opposed pairs of pads on the substrates despite misalignment of the substrates or lateral shifting of the plates at the interface because of forces exerted on the substrates. The plates are secured together to permit limited lateral movement at the interface. The assembly may have a circuit board plate between the top and bottom plates and two lateral shift interfaces. The contacts may have very small and high contact pressure shear-formed contact tips.

REFERENCES:
patent: 4538866 (1985-09-01), Johnson
patent: 4540229 (1985-09-01), Madden
patent: 4887974 (1989-12-01), Ichimura et al.
patent: 4927369 (1990-05-01), Grabbe et al.
patent: 5174763 (1992-12-01), Wilson
patent: 5217383 (1993-06-01), Hildebrandt et al.
patent: 5237743 (1993-08-01), Busacco et al.
patent: 5248262 (1993-09-01), Busacco et al.
patent: 5380210 (1995-01-01), Grabbe et al.
patent: 5415559 (1995-05-01), Ichimura
patent: 5470245 (1995-11-01), Ichimura
patent: 5704795 (1998-01-01), Lindeman
patent: 5953214 (1999-09-01), Dranchak et al.
patent: 6113440 (2000-09-01), Fijten et al.
patent: 6241531 (2001-06-01), Roath et al.
patent: 6281692 (2001-08-01), Bodenweber et al.
patent: 6390826 (2002-05-01), Affolter et al.
patent: 6488522 (2002-12-01), Fukunaga
patent: 6545226 (2003-04-01), Brodsky et al.
patent: 6730134 (2004-05-01), Neidich
patent: 6746252 (2004-06-01), Scott
patent: 6756797 (2004-06-01), Brandorff et al.
patent: 6892451 (2005-05-01), Brodsky et al.
patent: 6905343 (2005-06-01), Neidich
patent: 6974915 (2005-12-01), Brodsky et al.
patent: 7029289 (2006-04-01), Li
patent: 7126062 (2006-10-01), Vinther et al.
patent: 7241149 (2007-07-01), Abadia
patent: 7293995 (2007-11-01), Li
patent: 7404717 (2008-07-01), Kazama
patent: 7446544 (2008-11-01), Igarashi et al.
patent: 2006/0116004 (2006-06-01), Rathburn
patent: 6-36832 (1994-02-01), None
patent: 6-132044 (1994-05-01), None
patent: 9-312182 (1997-12-01), None
patent: 10-50419 (1998-02-01), None
patent: 10-55854 (1998-02-01), None
See present application—prior art Figures 12-C, 12-D and description at pp. 9 to 12 disclosing prior art interposer assemblies.

Affiliated with

Also associated with

Rating

Interposer assembly and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interposer assembly and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interposer assembly and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4166421