Interposer and module test card assembly

Details Interposer and module test card assembly Interposer and module test card assembly

1996-12-13

1999-07-27

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, G01R 107

Patent

active

059296461

ABSTRACT:
The preferred embodiment of the present invention provides an apparatus and method to facilitate the testing of semiconductor devices packaged in surface mount modules (such as ball grid array modules and cylinder grid array modules) while the module is connected to a system board. The preferred embodiment provides an interposer mechanism that includes a top array of interposer landing pads and a bottom array of interposer landing pads. The bottom array of interposer landing pads are connected to the top array of interposer landing pads. The preferred embodiment also provides a module test card mechanism. The module test card mechanism includes a plurality of landing pads arranged to receive the surface mount module. The plurality of landing pads are connected to a plurality of test pins, and a plurality of landing pads underneath the module test card mechanism. The surface mount module can be coupled the system board through the module test card mechanism and the interposer mechanism with the plurality of test pins providing access to the semiconductor device for testing.

REFERENCES:
patent: 3541222 (1970-11-01), Parks et al.
patent: 3982320 (1976-09-01), Buchoff et al.
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4707657 (1987-11-01), B.o slashed.egh-Peterson
patent: 4793814 (1988-12-01), Zifcak et al.
patent: 4862076 (1989-08-01), Renner et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 4969826 (1990-11-01), Grabbe
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5177594 (1993-01-01), Chance et al.
patent: 5207585 (1993-05-01), Byrnes et al.
patent: 5347162 (1994-09-01), Pasch
patent: 5408190 (1995-04-01), Wood et al.
patent: 5635846 (1997-06-01), Beaman et al.
patent: 5701085 (1997-12-01), Malladi et al.
E.W. Mace and P. Singh, Customable Multi-Contact-Point-Imposer, Apr. 1994, IBM Technical Disclosure Bulletin vol. 37 No. 04B pp. 105-106.
H. Li and P. Singh, High Density Compliant Connector and Socket, Sep. 1994, IBM Technical Disclosure Bulletin vol. 37, No. 09, pp. 395-396.

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