Interposer and methods for fabricating same

Details Interposer and methods for fabricating same Interposer and methods for fabricating same

2005-12-27

2005-12-27

Cuneo, Kamand (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090

Reexamination Certificate

active

06980014

ABSTRACT:
An interposer including a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, with a substrate. The fence may include edges that are configured to progressively align a semiconductor device with the substrate. The fence may also include one or more laterally recessed regions to facilitate rough alignment of a semiconductor device with the substrate. Methods for fabricating the fence include the use of stereolithographic and molding processes. When stereolithography is used to fabricate the fence, a machine vision system that includes at least one camera operably associated with a computer may be used to control a stereolithography apparatus and facilitates recognition of the position and orientation of substrates on and around which material is to be applied in one or more layers to form the fence. As a result, the substrates need not be precisely mechanically aligned.

REFERENCES:
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 4371912 (1983-02-01), Guzik
patent: 4466184 (1984-08-01), Cuneo et al.
patent: 4512509 (1985-04-01), Ellis et al.
patent: 4810868 (1989-03-01), Drexler
patent: 5012187 (1991-04-01), Littlebury
patent: 5014161 (1991-05-01), Lee et al.
patent: 5014418 (1991-05-01), Wright
patent: 5085362 (1992-02-01), Art et al.
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5278442 (1994-01-01), Prinz et al.
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 5475317 (1995-12-01), Smith
patent: 5484314 (1996-01-01), Farnworth
patent: 5500605 (1996-03-01), Chang
patent: 5559444 (1996-09-01), Farnworth et al.
patent: 5561326 (1996-10-01), Massingill et al.
patent: 5572140 (1996-11-01), Lim et al.
patent: 5625298 (1997-04-01), Hirano et al.
patent: 5633122 (1997-05-01), Tuttle
patent: 5634267 (1997-06-01), Farnworth et al.
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5705117 (1998-01-01), O'Connor et al.
patent: 5736279 (1998-04-01), Mott et al.
patent: 5773320 (1998-06-01), Bayerer
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5815000 (1998-09-01), Farnworth et al.
patent: 5915977 (1999-06-01), Hembree et al.
patent: 6002266 (1999-12-01), Briggs et al.
patent: 6016060 (2000-01-01), Akram et al.
patent: 6018249 (2000-01-01), Akram et al.
patent: 6114090 (2000-09-01), Wu et al.
patent: 6205660 (2001-03-01), Fjelstad et al.
patent: 6242932 (2001-06-01), Hembree
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6297654 (2001-10-01), Barabi
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6400174 (2002-06-01), Akram et al.
patent: 6468891 (2002-10-01), Williams
patent: 6500746 (2002-12-01), Williams
patent: 6524346 (2003-02-01), Farnworth
patent: 6529027 (2003-03-01), Akram et al.
patent: 6531335 (2003-03-01), Grigg
patent: 6537842 (2003-03-01), Akram
patent: 6611053 (2003-08-01), Akram
patent: 6630730 (2003-10-01), Grigg
patent: 6632732 (2003-10-01), Williams
patent: 2001/0035597 (2001-11-01), Grigg et al.
patent: 2001/0051395 (2001-12-01), Grigg et al.
patent: 2002/0102829 (2002-08-01), Williams
patent: 2002/0111003 (2002-08-01), Williams
patent: 2002/0171177 (2002-11-01), Kritchman et al.
patent: 2003/0045047 (2003-03-01), Williams
patent: 2003/0068840 (2003-04-01), Grigg
patent: 2003/0098470 (2003-05-01), Williams
patent: 2003/0102566 (2003-06-01), Farnworth
patent: 2003/0111727 (2003-06-01), Kurusu
patent: 2003/0151167 (2003-08-01), Kritchman et al.
patent: 2003/0180974 (2003-09-01), Akram
patent: 2003/0181003 (2003-09-01), Akram
patent: 2003/0186496 (2003-10-01), Akram
Miller et al., “Maskless Mesoscale Materials Deposition”, Deposition Technology, Sep. 2001, pp. 20-22.
Miller, “New Laser-Directed Deposition Technology”, Microelectronic Fabrication, Aug. 2001, page 16.
Webpage, Object Prototyping the Future, Objet FullCure 700 Series, 1 page.
Webpage, Object Prototyping the Future, How it Works, 2 pages, 2003.
U.S. Appl. No. 09/511,986, filed Feb. 24, 2000, entitled “Stereolithographically Fabricated Conductive Elements, Semiconductor Device Components and Assemblies Including Such Conductive Elements, and Methods”, inventor Vernon M. Williams.
U.S. Appl. No. 10/619,963, filed Jul. 15, 2003, entitled “Stereolithographic Methods for Securing Conductive Elements to Contacts of Semiconductor Device Components”, inventor Vernon M. Williams.
U.S. Appl. No. 10/641,471, filed Aug. 14, 2003, entitled “Protective Structures for Bond Wires”, inventor Salman Akram.

Affiliated with

Also associated with

Rating

Interposer and methods for fabricating same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interposer and methods for fabricating same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interposer and methods for fabricating same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3522708