Interposer and method for manufacturing the same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S262000

Reexamination Certificate

active

07863524

ABSTRACT:
The interposer includes a glass substrate46with first through-electrodes47buried in; a plurality of resin layers68, 20, 32supported by the glass substrate; thin film capacitors18a, 18bburied between a first resin layer68of the plural resin layers and a second resin layer20of the plural resin layers and including the first capacitor electrodes12a, 12b, the second capacitor electrodes16opposed to the first capacitor electrodes12a, 12b, and a dielectric thin film14of a relative dielectric constant of 200 or above formed between the first capacitor electrode12a, 12band the second capacitor electrode16, and the second through-electrodes77a, 77bpenetrating the plural resin layers68, 20, 32, electrically connected to the first through-electrode47and electrically connected to the first capacitor electrode12a, 12bor the second capacitor electrode16.

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K. Matsumaru, et al.; “Transmission characteristics of the Silicon Through-hole Interconnections and the Glass Through-hole Interconnections;”The15thMicroelectronics Symposium(MES2005); Oct. 2005; pp. 193-196 (2 Sheets.)/Yes-Abstract.

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